Samsung develops industry’s first 36GB HBM3E 12H DRAM
Samsung, the world leader in semiconductor memory chips, has announced that it has developed the industry's first 12-stack HBM3E DRAM chip. It is the world's highest-capacity HBM memory chip to date, and the company claims that it offers 50% higher capacity and performance than previous-generation HBM memory chips.
Samsung unveils industry's first 36GB HBM3E DRAM chip
According to Samsung, its HBM3E 12H chip offers a bandwidth of up to 1,280GB/s and a capacity of up to 36GB. That is 50% higher than current-generation…