Apple to become TSMC’s biggest customer for enhanced 3nm process
Apple is gearing up for a significant upgrade across its product line with the introduction of TSMC’s next-generation 3nm processors, namely the M4 and A18 chips. Reports from the Economic Daily News suggest that these processors, slated for iPads, MacBooks, and iPhones, will feature a significant improvement in Neural Engine, signaling a substantial boost in orders to TSMC. Industry experts are expecting this surge in demand to drive TSMC’s production volume for its enhanced 3-nanometer process (N3E) up by over 50% compared to the previous year.
Recognizing the growing importance of AI computing, Apple is not only enhancing the AI computing power of its current M3 and A17 Pro chips but is also working on elevating the number and efficiency of AI computing cores in the upcoming M4 and A18 chips. This strategic move aligns with the company’s vision to adopt and enhance the application of AI across all its product lines, aiming for a significant improvement in AI computing performance within its products. Consequently, Apple’s increased computational power demands are resulting in a substantial uptick in orders for TSMC.
Apple’s orders for TSMC’s enhanced 3nm process may surpass last year’s figures by over 50%
Reports suggest that Apple’s orders for TSMC’s enhanced 3nm process may surpass last year’s figures by over 50%, underscoring Apple’s position as TSMC’s largest customer. Additionally, Apple has secured a significant amount of advanced packaging capacity from TSMC. It primarily focuses on advanced packaging technologies like InFO and CoWoS, which are crucial for enhancing performance and efficiency in their devices.
Looking ahead, Apple may push the envelope further by leveraging TSMC’s advanced packaging capabilities to their fullest extent, including exploring options like the 3D structure SoIC advanced packaging. TSMC is gearing up to meet the surge in demand, not only for its 3nm process but also for advanced packaging, driven by major clients like Apple, NVIDIA, and AMD.
TrendForce’s data indicates that TSMC’s 3nm process alone contributed significantly to its Q3 revenue, with advanced processes (≤7nm) dominating nearly 60% of its total revenue. With a substantial portion of its capital budget allocated for advanced processes and packaging, TSMC is expected to cater to the evolving demands of its key clients.
Apple is gearing up for a significant upgrade across its product line with the introduction of TSMC’s next-generation 3nm processors, namely the M4 and A18 chips. Reports from the Economic Daily News suggest that these processors, slated for iPads, MacBooks, and iPhones, will feature a significant improvement in Neural Engine, signaling a substantial boost in orders to TSMC. Industry experts are expecting this surge in demand to drive TSMC’s production volume for its enhanced 3-nanometer process (N3E) up by over 50% compared to the previous year.
Recognizing the growing importance of AI computing, Apple is not only enhancing the AI computing power of its current M3 and A17 Pro chips but is also working on elevating the number and efficiency of AI computing cores in the upcoming M4 and A18 chips. This strategic move aligns with the company’s vision to adopt and enhance the application of AI across all its product lines, aiming for a significant improvement in AI computing performance within its products. Consequently, Apple’s increased computational power demands are resulting in a substantial uptick in orders for TSMC.
Apple’s orders for TSMC’s enhanced 3nm process may surpass last year’s figures by over 50%
Reports suggest that Apple’s orders for TSMC’s enhanced 3nm process may surpass last year’s figures by over 50%, underscoring Apple’s position as TSMC’s largest customer. Additionally, Apple has secured a significant amount of advanced packaging capacity from TSMC. It primarily focuses on advanced packaging technologies like InFO and CoWoS, which are crucial for enhancing performance and efficiency in their devices.
Looking ahead, Apple may push the envelope further by leveraging TSMC’s advanced packaging capabilities to their fullest extent, including exploring options like the 3D structure SoIC advanced packaging. TSMC is gearing up to meet the surge in demand, not only for its 3nm process but also for advanced packaging, driven by major clients like Apple, NVIDIA, and AMD.
TrendForce’s data indicates that TSMC’s 3nm process alone contributed significantly to its Q3 revenue, with advanced processes (≤7nm) dominating nearly 60% of its total revenue. With a substantial portion of its capital budget allocated for advanced processes and packaging, TSMC is expected to cater to the evolving demands of its key clients.
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