Intel shows Lunar Lake processor in flesh at CES 2024

At the Open House keynote at CES 2024, Intel announced the availability details of the Lunar Lake platform, an upcoming lineup of low-power processors that are targeted towards thin and light devices (mainly laptops). More importantly, the company showcased the finished version of a chipset from the Lunar Lake family, which reveals some interesting details about the upcoming processors. Let’s take a look.

According to Intel, it has started shipping the Lunar Lake systems to partners, which suggests that we could see devices (mostly laptops) with the new processors by the end of this year, just like the company had promised earlier. As for showing the finished version of the Lunar Lake chipset, the media present at the event managed to capture detailed images of the processor, which reveals some interesting details.

As noted by Guru 3D, the Lunar Lake chipset has the Memory on Package (MoP) design, the same approach that Apple took with the M-series processor. The demo chipset had two DRAM packages with LPDDR5X-8533 memory. The publication also noted that the processor has a 4+4 core configuration (4 performance cores + 4 efficiency cores).

According to the company, Lunar Lake has a new NPU that offers 3x higher performance compared to the current models. The upcoming processors also have a new graphics architecture based on Battlemage (Xe2). The Lunar Lake processors are expected to compete directly with Qualcomm’s X Elite series, which was announced last month.

At the Open House keynote at CES 2024, Intel announced the availability details of the Lunar Lake platform, an upcoming lineup of low-power processors that are targeted towards thin and light devices (mainly laptops). More importantly, the company showcased the finished version of a chipset from the Lunar Lake family, which reveals some interesting details about the upcoming processors. Let’s take a look.

According to Intel, it has started shipping the Lunar Lake systems to partners, which suggests that we could see devices (mostly laptops) with the new processors by the end of this year, just like the company had promised earlier. As for showing the finished version of the Lunar Lake chipset, the media present at the event managed to capture detailed images of the processor, which reveals some interesting details.

As noted by Guru 3D, the Lunar Lake chipset has the Memory on Package (MoP) design, the same approach that Apple took with the M-series processor. The demo chipset had two DRAM packages with LPDDR5X-8533 memory. The publication also noted that the processor has a 4+4 core configuration (4 performance cores + 4 efficiency cores).

According to the company, Lunar Lake has a new NPU that offers 3x higher performance compared to the current models. The upcoming processors also have a new graphics architecture based on Battlemage (Xe2). The Lunar Lake processors are expected to compete directly with Qualcomm’s X Elite series, which was announced last month.