MediaTek Dimensity 6100+ 5G chipset with 108MP camera support announced
MediaTek Dimensity 6100+ chipset specs
- 5G: The new Dimensity 6100+ SoC integrates an enhanced 5G model that supports 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation.
- Power consumption: The chipmaker says this will significantly reduce power consumption contributed by MediaTek UltraSave 3.0+ technology. This is claimed to offer a 20 percent reduced 5G power consumption compared to competitive solutions.
- Processor: This chip features two ARM Cortex-A76 big cores and six ARM Cortex-A55 efficiency cores. These offer notable improvements, including support for AI-powered cameras, 10-bit displays, and outstanding UX and GPU performance.
- GPU: The Dimensity 6100+ is paired with Mali-G57 MC2.
- RAM and Storage: The chipset has support for LPDDR4x memory and UFS 2.2 storage.
- Cameras: The chipset supports up to 108MP Non-ZSL camera support and up to 2K 30fps video recording. Powerful camera features including AI-bokeh for stunning portraits and selfies and AI-colour technology.
- Display: The chipset supports a 10-bit display and reproduces more than one billion colours for vibrant images and videos. There is support for 90Hz to 120Hz frame rates for a smooth user experience.
- Connectivity: Wi-Fi 5, Bluetooth v5.2, GPS (L1CA+L5), BeiDou, Glonass, Galileo, QZSS, NavIC, 4G Carrier Aggregation, and SA/NSA modes.
Availability of Dimensity 6100+: The first smartphone featuring the Dimensity 6100+ chipset will be available in the third quarter of 2023.
MediaTek as well places its 5G chipsets in different price tiers. The Dimensity 9000 series is designed for flagships, the Dimensity 8000 family is for premium mid-range phones, the Dimensity 7000 series is for high-tech devices and the new Dimensity 6000 series is for budget 5G offerings.
MediaTek Dimensity 6100+ chipset specs
- 5G: The new Dimensity 6100+ SoC integrates an enhanced 5G model that supports 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation.
- Power consumption: The chipmaker says this will significantly reduce power consumption contributed by MediaTek UltraSave 3.0+ technology. This is claimed to offer a 20 percent reduced 5G power consumption compared to competitive solutions.
- Processor: This chip features two ARM Cortex-A76 big cores and six ARM Cortex-A55 efficiency cores. These offer notable improvements, including support for AI-powered cameras, 10-bit displays, and outstanding UX and GPU performance.
- GPU: The Dimensity 6100+ is paired with Mali-G57 MC2.
- RAM and Storage: The chipset has support for LPDDR4x memory and UFS 2.2 storage.
- Cameras: The chipset supports up to 108MP Non-ZSL camera support and up to 2K 30fps video recording. Powerful camera features including AI-bokeh for stunning portraits and selfies and AI-colour technology.
- Display: The chipset supports a 10-bit display and reproduces more than one billion colours for vibrant images and videos. There is support for 90Hz to 120Hz frame rates for a smooth user experience.
- Connectivity: Wi-Fi 5, Bluetooth v5.2, GPS (L1CA+L5), BeiDou, Glonass, Galileo, QZSS, NavIC, 4G Carrier Aggregation, and SA/NSA modes.
Availability of Dimensity 6100+: The first smartphone featuring the Dimensity 6100+ chipset will be available in the third quarter of 2023.
MediaTek as well places its 5G chipsets in different price tiers. The Dimensity 9000 series is designed for flagships, the Dimensity 8000 family is for premium mid-range phones, the Dimensity 7000 series is for high-tech devices and the new Dimensity 6000 series is for budget 5G offerings.
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