MediaTek Dimensity 8300 SoC launched with Wi-Fi 6E and generative AI capabilities
As per the company, Dimensity 8300 will power 5G devices launching in the global market before the end of 2023. We have also spotted the Redmi K70 on Geekbench with the MediaTek Dimensity 8300 SoC. Here’s all we know about the new processor.
Mediatek Dimensity 8300 specifications
- CPU: The Dimensity 8300 houses an octa-core CPU with four Cortex-A715 cores and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture. As stated, this core configuration enables the chip to achieve 20 percent faster CPU performance and 30 percent peak gains in power efficiency compared to its predecessor, according to the company.
- GPU: The new chipset comes with a Mali-G615 MC6 GPU and claims to provide up to 60 percent greater performance and 55 percent better power efficiency. The HyperEngine adaptive game technology claims advanced power savings by adapting to computing demands and monitoring device temperature, ensuring devices remain cool while optimising gameplay.
- APU: The MediaTek Dimensity 8300 comes with the APU 780 AI processor integrated into the chipset. This integration enables the chip to support developers in building innovative applications that leverage large language models (LLMs) up to 10B, as well as stable diffusion. The APU 780 shares the same architecture as the flagship Dimensity 9300 SoC and claims a 2x improvement in INT and FP16 computation, along with a 3.3x boost in AI performance compared to the Dimensity 8200.
- Display: The chipset features AI Region PQ technology, which distinguishes regions within each video scene to selectively adjust contrast and sharpness through AI-Segmentation. The processor supports a WQHD+ display at up to a 120Hz refresh rate and a Full HD+ display at up to a 180Hz refresh rate. The chip also includes HDR10+ adaptive support.
- Cameras: The chipset utilises MediaTek’s 14-bit HDR-ISP Imagiq 980 and promises sharper, clearer videography capabilities at 4K60 HDR. It is also designed to enable longer recording sessions with an efficient power design.
- Memory: The chipset comes with LPDDR5X 8533Mbps and uFS4.0 MCQ memory. It claims to provide a 33 percent speed boost on LPDDR and up to 100% faster read/write speed to flash compared to Dimensity 8200.
- 5G: The processor comes with a built-in 3GPP Release-16 standard 5G modem, providing improved connectivity in environments with weaker connections. The modem supports 3CC carrier aggregation, offering up to 5.17Gbps downlink speeds. With MediaTek 5G UltraSave 3.0 technology, the chip claims to improve 5G power efficiency by up to 20 percent in daily usage scenarios.
- Wi-Fi: The chipset comes with Wi-Fi 6E and promises enhanced performance with 160 MHz bandwidth. It incorporates Wi-Fi/Bluetooth hybrid coexistence technology which claims to provide improved peripheral support.
As per the company, Dimensity 8300 will power 5G devices launching in the global market before the end of 2023. We have also spotted the Redmi K70 on Geekbench with the MediaTek Dimensity 8300 SoC. Here’s all we know about the new processor.
Mediatek Dimensity 8300 specifications
- CPU: The Dimensity 8300 houses an octa-core CPU with four Cortex-A715 cores and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture. As stated, this core configuration enables the chip to achieve 20 percent faster CPU performance and 30 percent peak gains in power efficiency compared to its predecessor, according to the company.
- GPU: The new chipset comes with a Mali-G615 MC6 GPU and claims to provide up to 60 percent greater performance and 55 percent better power efficiency. The HyperEngine adaptive game technology claims advanced power savings by adapting to computing demands and monitoring device temperature, ensuring devices remain cool while optimising gameplay.
- APU: The MediaTek Dimensity 8300 comes with the APU 780 AI processor integrated into the chipset. This integration enables the chip to support developers in building innovative applications that leverage large language models (LLMs) up to 10B, as well as stable diffusion. The APU 780 shares the same architecture as the flagship Dimensity 9300 SoC and claims a 2x improvement in INT and FP16 computation, along with a 3.3x boost in AI performance compared to the Dimensity 8200.
- Display: The chipset features AI Region PQ technology, which distinguishes regions within each video scene to selectively adjust contrast and sharpness through AI-Segmentation. The processor supports a WQHD+ display at up to a 120Hz refresh rate and a Full HD+ display at up to a 180Hz refresh rate. The chip also includes HDR10+ adaptive support.
- Cameras: The chipset utilises MediaTek’s 14-bit HDR-ISP Imagiq 980 and promises sharper, clearer videography capabilities at 4K60 HDR. It is also designed to enable longer recording sessions with an efficient power design.
- Memory: The chipset comes with LPDDR5X 8533Mbps and uFS4.0 MCQ memory. It claims to provide a 33 percent speed boost on LPDDR and up to 100% faster read/write speed to flash compared to Dimensity 8200.
- 5G: The processor comes with a built-in 3GPP Release-16 standard 5G modem, providing improved connectivity in environments with weaker connections. The modem supports 3CC carrier aggregation, offering up to 5.17Gbps downlink speeds. With MediaTek 5G UltraSave 3.0 technology, the chip claims to improve 5G power efficiency by up to 20 percent in daily usage scenarios.
- Wi-Fi: The chipset comes with Wi-Fi 6E and promises enhanced performance with 160 MHz bandwidth. It incorporates Wi-Fi/Bluetooth hybrid coexistence technology which claims to provide improved peripheral support.
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