Qualcomm announces new S3 Gen 2 Sound platform chipset: All the details
US-based chipmaker Qualcomm has expanded its S3 Gen 2 Sound platform portfolio with a new chipset. The company claims that the latest chipset is designed specifically for gaming. As per Qualcomm, the optimised solution will combine Snapdragon Sound and LE Audio to deliver wireless audio with ultra-low latency of less than 20ms. The company promises that this chipset will ensure a lag-free gaming experience and it will also incorporate a voice back-channel for in-game chat.
Qualcomm’s S3 Gen 2 Sound platform: Gaming, music enhancements
In addition to its gaming capabilities, this new solution will also support LE Audio Auracast broadcast capabilities. This will allow dongles and adapters to transform various devices into premium broadcast platforms. The latest solution will also enable high-resolution Bluetooth streaming of music at 24-bit 96kHz. It will use Snapdragon Sound and Qualcomm aptX Adaptive audio technology to achieve this.
Qualcomm’s S3 Gen 2 Sound platform: Connectivity improvements
The company claims that this solution is specifically optimised for adapters used in audio sources. It will provide improved connectivity and dynamic latency adaption based on the external RF environment.
Qualcomm’s S3 Gen 2 Sound platform: Other key highlights
Qualcomm S3 Gen 2 Sound platform will also deliver new user experiences with Bluetooth LE Audio. This solution supports a range of LE Audio-enabled use cases for earbuds and stereo headphones. These use cases include — audio sharing, broadcast and gaming mode. The chipmaker claims that the solution’s LE Audio and Bluetooth integration will enable seamless feature adoption for various listening scenarios.
In addition, the Qualcomm S3 Gen 2 Sound Platform will provide improved lossless audio quality, enhanced robustness, and lower latency with voice back-channel for in-game chats on devices that support Snapdragon Sound. The solution will also support clear voice calls with 32kHz super wideband voice calls and advanced noise cancellation technology..
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The latest solution will also ensure low latency for a natural and immersive spatial audio experience between the phone and earbuds. It will also optimise spatialisation, stereo rotation, and head orientation for a seamless and power-efficient performance.
Qualcomm’s S3 Gen 2 Sound platform also incorporates 3rd gen Qualcomm Hybrid Adaptive Active Noise Cancellation (ANC). This tool will adapt to the in-ear fit and external environment of the user. The solution also features an Adaptive Transparency mode. This feature claims to enable smooth switching between noise-cancelling and ambient sound for situational awareness.
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US-based chipmaker Qualcomm has expanded its S3 Gen 2 Sound platform portfolio with a new chipset. The company claims that the latest chipset is designed specifically for gaming. As per Qualcomm, the optimised solution will combine Snapdragon Sound and LE Audio to deliver wireless audio with ultra-low latency of less than 20ms. The company promises that this chipset will ensure a lag-free gaming experience and it will also incorporate a voice back-channel for in-game chat.
Qualcomm’s S3 Gen 2 Sound platform: Gaming, music enhancements
In addition to its gaming capabilities, this new solution will also support LE Audio Auracast broadcast capabilities. This will allow dongles and adapters to transform various devices into premium broadcast platforms. The latest solution will also enable high-resolution Bluetooth streaming of music at 24-bit 96kHz. It will use Snapdragon Sound and Qualcomm aptX Adaptive audio technology to achieve this.
Qualcomm’s S3 Gen 2 Sound platform: Connectivity improvements
The company claims that this solution is specifically optimised for adapters used in audio sources. It will provide improved connectivity and dynamic latency adaption based on the external RF environment.
Qualcomm’s S3 Gen 2 Sound platform: Other key highlights
Qualcomm S3 Gen 2 Sound platform will also deliver new user experiences with Bluetooth LE Audio. This solution supports a range of LE Audio-enabled use cases for earbuds and stereo headphones. These use cases include — audio sharing, broadcast and gaming mode. The chipmaker claims that the solution’s LE Audio and Bluetooth integration will enable seamless feature adoption for various listening scenarios.
In addition, the Qualcomm S3 Gen 2 Sound Platform will provide improved lossless audio quality, enhanced robustness, and lower latency with voice back-channel for in-game chats on devices that support Snapdragon Sound. The solution will also support clear voice calls with 32kHz super wideband voice calls and advanced noise cancellation technology..
Read Also
The latest solution will also ensure low latency for a natural and immersive spatial audio experience between the phone and earbuds. It will also optimise spatialisation, stereo rotation, and head orientation for a seamless and power-efficient performance.
Qualcomm’s S3 Gen 2 Sound platform also incorporates 3rd gen Qualcomm Hybrid Adaptive Active Noise Cancellation (ANC). This tool will adapt to the in-ear fit and external environment of the user. The solution also features an Adaptive Transparency mode. This feature claims to enable smooth switching between noise-cancelling and ambient sound for situational awareness.
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